取款宝 - 最权威的电子平台

High-power LED chip thermal packaging technology is divided into: high thermal packaging structure and flip-chip packaging structure. The specific methods of LED manufacturers for heat dissipation packaging include reducing the thermal resistance of the package, improving the shape of the chip, adopting small dies, and using silicon packaging materials and ceramic materials to increase the life of the LED and improve the packaging method of the LED.

LED lights mainly dissipate heat. If the temperature of the light source is too high, the temperature of the subsequent whole lamp must be too high. This will definitely cause the LED light to flicker or be damaged.

No matter what kind of light source is used to illuminate, it is inevitable to deal with the problem of heat dissipation. The heat dissipation of lighting fixtures has always attracted much attention because the operating temperature of the light source is closely related to its working life. LED lighting sources, while converting electrical energy into light energy, a considerable portion of electrical energy is also converted into thermal energy. The research on heat dissipation of LEDs for LED lighting mainly focuses on the heat dissipation structure of LED packages and lamps.

At present, the heat dissipation research on LED packages has basically solved the heat dissipation problem of low-power LEDs. With the increasing popularity of high-power LED lighting, the research on high-power LED packages has invested a lot of manpower Financial resources have made great breakthroughs.

Large manufacturers at home and abroad are working to overcome the heat dissipation problem, and I believe that it will be able to further overcome the heat dissipation problem of high-power LED lighting products in the future.